01 반도체 테스트의 이해
01.？ 반도체 후공정 ······················································ 5
02.？ 테스트의 종류······················································ 8
03.？ 웨이퍼 테스트 ···················································· 10
EPM ································································ 13
웨이퍼 번인······················································· 13
테스트 ····························································· 14
리페어······························································ 15
04.？ 패키지 테스트 ···················································· 16
TDBI································································ 17
테스트 ····························································· 18
외관 검사·························································· 18
02 반도체 패키지의 정의와 역할
01.？ 반도체 패키지의 정의········································· 25
02.？ 반도체 패키지의 역할 ········································ 26
03.？ 반도체 패키지의 개발 트렌드····························· 28
04
